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Heat-resistant epoxy resin adhesive is an adhesive formulated with modified epoxy resin. It can be used intermittently at 250°C, and can even be used at 400°C for a long time and at 460°C for a short time. The matrix resin of this kind of adhesive generally introduces more rigid groups or increases the cross-linking density

Generally, the structure of epoxy resin contains hydroxyl groups and ether bonds, which make it highly adhesive. Due to these polar groups, electromagnetic forces can be generated at adjacent interfaces. During the curing process, along with the chemical interaction with the curing agent, warp groups and ether bonds can be further generated, which not only