Epoxy resin is the polymerisation production of bisphenol A and epichlorohydrin. It has the characteristics of high mechanical properties, strong cohesion, dense molecular structure, excellent adhesive properties, small curing shrinkage (stable product size, low internal stress, not easy to crack), good insulation, good corrosion resistance, good stability, good heat resistance (up to 200 °C or higher), so it is widely used in the field of coatings, electronic and electrical appliances, composites, adhesives and so on.
The production process of epoxy resin is generally divided into one-step method and two-step method. The one-step method is to generate epoxy resin through the direct reaction of bisphenol A and epichlorohydrin, which is often used to synthesize low molecular weight and medium molecular weight epoxy resins; the two-step method is to continue the reaction of low molecular weight resin with bisphenol A. High molecular weight epoxy resins can be synthesized by a one-step method or a two-step method.
The one-step process is to shrink bisphenol A and epichlorohydrin under the action of NaOH, that is, perform ring-opening and ring-closing reactions under the same reaction conditions. At present, E-44 epoxy resin, which has the largest domestic output, is synthesized through a one-step process. In the two-step process, under the action of a catalyst (such as a quaternary ammonium salt), bisphenol A and epichlorohydrin undergo an addition reaction in the first step to generate a bisphenol propane chlorohydrin ether intermediate. In the second step, a ring-closing reaction is performed in the presence of NaOH to generate epoxy resin. The advantages of the two-step method are short reaction time; stable operation, small temperature fluctuation and easy control; short alkali addition time, which can avoid large-scale hydrolysis of epichlorohydrin. The two-step process to synthesize epoxy resin is also widely used.
Electronic sealants refer to a series of electronic glues and adhesives required for sealing electronic devices, including sealing, sealing, and potting. Packaged electronic equipment can play the role of waterproof, shockproof, dustproof, anti-corrosion, heat dissipation, and confidentiality. Therefore, the glue that needs to be packaged has the characteristics of high temperature resistance, low temperature resistance, high dielectric strength, good insulation, environmental protection, and safety.
Epoxy resin has excellent heat resistance, electrical insulation, sealing, dielectric properties, mechanical properties and low shrinkage and chemical resistance. When formulated with a curing agent, it can have better operability and all material properties required for electronic material packaging.
Epoxy resin potting glue has significant advantages in high temperature environments.
1. First, its bonding strength at high temperatures is very high, and it can effectively bond different materials tightly together, thereby providing a good sealing effect.
2. Secondly, epoxy resin potting glue has excellent corrosion resistance and can maintain stable performance in high-temperature acidic or alkaline environments.
3. In addition, epoxy resin potting glue also has excellent mechanical properties and can withstand various stresses in high temperature environments.
In the fields of aerospace, automobiles, and machinery manufacturing, epoxy resin potting adhesives are widely used. For example, in the aerospace field, epoxy resin potting glue can be used to seal key components, such as engines, control systems, etc. In automotive manufacturing, it can be used to seal engines, chassis, and electrical systems. In the field of machinery manufacturing, epoxy resin potting glue can protect key components and improve sealing performance.
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