Epoxy resin adhesive is formulated with 0164 epoxy resin as the main body. There are epoxy groups at the ends of the resin macromolecules, hydroxyl and ether bonds between the chains, and hydroxyl and ether bonds will continue to be generated during the curing process. The structure contains benzene rings and heterocyclic rings. These structures determine the excellent performance of epoxy resin adhesives. Epoxy resin adhesive is an adhesive with a long history and extremely wide range of uses. Epoxy resin adhesives are recognized by a wide range of users due to their strength, versatility, and excellent adhesion to a wide variety of adhered surfaces. They have participated in and accelerated technological revolutions in certain industrial sectors. Epoxy resins can be used to bond metal, glass, ceramics, many plastics, wood, concrete, and several other surfaces.
Adhesive bonding refers to the technology of connecting the surfaces of homogeneous or heterogeneous objects together with adhesive. It has the characteristics of continuous stress-distributed adhesive cloth, light weight, or sealing, and most process temperatures are low. Gluing is particularly suitable for connecting different materials, different thicknesses, ultra-thin specifications, and complex components. Glue has developed the fastest in recent generations, has a wide range of application industries, and has a significant impact on the progress of high-tech science and technology and the improvement of people’s daily lives. Therefore, it is very important to research, develop and produce various types of adhesives.
Epoxy resin adhesive refers to a general term for compounds that contain two or more epoxy groups in a molecular structure and can form a three-dimensional cross-linked curing compound under appropriate chemical reagents and conditions.
Epoxy resin adhesive is a liquid or solid adhesive composed of 0164 epoxy resin, curing agent, plasticizer, accelerator, diluent, filler, coupling agent, flame retardant, stabilizer, etc. Among them, 0164 epoxy resin, curing agent and toughening agent are indispensable components, and others can be added according to needs. The bonding process of epoxy adhesive is a complex physical and chemical process, including wetting, adhesion, curing and other steps, and finally generates a cured product with a three-dimensional cross-linked structure, which combines the adherend into a whole.
There are many types of epoxy adhesives. Among all types of epoxy resins, bisphenol A epoxy resin is the one with the largest output and the most widely used. According to its molecular weight, it can be divided into low, medium, high, and ultra-high molecular weight epoxy resins (polyphenolics resin). Low molecular weight resins can be cured at room temperature or high temperature, but high molecular weight epoxy resins must be cured at high temperatures, while ultra-high molecular weight polyphenolics resins do not require the use of curing agents and can form a tough film at high temperatures. With the successive proposals of various adhesion theories, as well as the in-depth progress of basic research work such as adhesive chemistry, adhesive rheology, and adhesive failure mechanisms, adhesive properties, varieties, and applications have developed rapidly. 0164 epoxy resin and its curing system have also become an important type of adhesive with excellent performance, many varieties and wide adaptability due to its unique and excellent properties and the continuous emergence of new epoxy resins, new curing agents and additives.
In recent years, high-strength and lightweight fiber-reinforced composite materials have been gradually used in ultra-low temperature environments, and research on the ultra-low temperature properties of epoxy resin has also been increasingly intensified. Our country’s research has made some progress in terms of being used as a matrix material for composite liquid hydrogen storage tanks and as a matrix material for adhesives, impregnation materials and fiber-reinforced composite materials in the field of superconductivity. Pure epoxy resin has a high cross-linking density and has shortcomings such as brittleness, low toughness, and poor impact resistance even at room temperature. As the resin matrix of composite materials, it generally needs to be cured at very high temperatures. During the cooling process after solidification, thermal stress will be generated inside the heat-shrinkable resin matrix. When the temperature drops from room temperature to ultra-low temperature (below -150°C), the internal stress generated by thermal shrinkage in the matrix will be more significant. Once the thermal stress exceeds the strength of the resin itself, it will cause damage to the resin matrix. Therefore, improving toughness is critical for the use of epoxy resins at ultra-low temperatures. The current method to improve the ultra-low temperature toughness of epoxy resin is mainly to use flexible aliphatic resin, liquid rubber, and flexible curing agent to toughen epoxy resin. Due to the low glass transition temperature of this type of material, it has a large free volume at room temperature. When the temperature drops to ultra-low temperatures, the resin system will undergo great thermal shrinkage, resulting in large thermal stress, which limits its application at ultra-low temperatures. The blending modification of high-performance thermoplastics and epoxy resins at room temperature allows the blending system to have the superior properties of both, that is, while maintaining the high modulus of the thermosetting resin, it also has the high toughness of the thermoplastic.
The bonding performance of the adhesive not only depends on its structure and performance, as well as the structure and adhesive properties of the surface of the adherend, but is also closely related to joint design, adhesive preparation, and bonding technology, and is also restricted by the surrounding environment. Therefore, the application of epoxy adhesive is a systematic project. The performance of the epoxy adhesive must be compatible with the factors affecting the bonding performance mentioned above to obtain the best results. When epoxy adhesives of the same formula are used to bond objects of different properties, or use different bonding conditions, or in different usage environments, their performance will be greatly different, and full attention should be paid to the application.
Epoxy adhesives are mainly composed of 0164 epoxy resin and curing agent. To improve certain properties and meet different uses, auxiliary materials such as tougheners, diluents, accelerators, and coupling agents can also be added. Due to its high bonding strength and strong versatility, epoxy adhesives were once known as “universal glue” and “powerful glue”. They are widely used in aviation, aerospace, automobiles, machinery, construction, chemical industry, light industry, electronics, electrical appliances, and daily life. It has been widely used in other fields.
With the improvement of our country’s environmental protection regulations and the improvement of people’s own health awareness, environmentally friendly epoxy adhesives with good quality, no pollution and in line with international standards are gradually becoming the mainstream products of synthetic adhesives.
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